460 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This section describes detailed requirements for a DPA of commonly used fuses. These requirements supplement the general requirements in section 4.
DLA
Method
/ C
Active
The shock test is intended to determine the suitability of the devices for use in electronic equipment which may be subjected to moderately severe shocks as a result...
DLA
Method
5 /
Active
The purpose of this test is to describe requirements for performance of destructive physical analysis (DPA) for the applicable device class, for sampling, preparation,...
DLA
Method
1 /
Active
The burn-in test is performed for the purpose of screening or eliminating marginal devices, those with inherent defects or defects resulting from manufacturing...
DLA
Method
12 /
Active
This test method is performed to determine whether semiconductor device terminations can withstand the effects of the heat to which they will be subjected during the...
DLA
Method
5 / A w/Change5
Active
DLA
Detail / Drawing
R / -
Active
The purpose of this test is to measure the time required for the junction to reach 90 percent of the final value of junction temperature change following application...
DLA
Method
/ w/Change1
Active
Test Site Transfer of RH, SMD, Class-S, Special flow and MIL-STD-883 products from Analog Devices Milpitas to Analog Devices General Trias (ADGT), Philippines
Alert Documents
- /
Active
The purpose of this test is to measure the thermal impedance of the insulated gate bipolar transistors (IGBT) under the specified conditions of applied voltage,...
DLA
Method
/ w/Change1
Active
This test method is intended to detect any semiconductor device discontinuity "ringing" or shifting of the reverse dc voltage characteristic monitored during vibration.
DLA
Method
/ A w/Change4
Active