460 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test is to determine the axial tensile load which can be applied to a mated pair of connectors and the holding effect of a connector cable clamp...
DLA
Method
1 / A
Cancelled
The moisture resistance test is performed for the purpose of evaluating, in an accelerated manner, the resistance of component parts and constituent materials to the...
DLA
Method
/
Active
This method establishes the requirements for the lot acceptance testing of microcircuit wafers intended for class level S use.
DLA
Method
8 /
Active
The purpose of this test is to deternine the effecls of a controlled salt laden atmosphere on electrical connector components, finishes, Mechanisms and permit...
DLA
Method
1 / A
Cancelled
To verify that markings or color coding will not become illegible or discolored on the parts (including printed wiring boards) when subjected to solvents and processes...
DLA
Method
/ w/Change 1
Active
The purpose of this test method is to determine semiconductor device design susceptibility to intermittent open failures in conformally coated printed boards...
DLA
Method
1 / A w/Change4
Active
The purpose of this test is to measure the reverse-voltage transfer ratio of the device under the specified conditions.
DLA
Method
/ w/Change1
Active
This method establishes qualification and quality conformance inspection procedures for microelectronics to assure that the device and lot quality conforms with the...
DLA
Method
17 /
Active
The purpose of this test is to measure the gate charge (Qg) of power MOSFETs and IGBT.
DLA
Method
3 / w/Change1
Active
This test is performed for the purpose of determining the flammability of a part exposed to an external flame. Flammability is defined as the ability of a part to...
DLA
Method
/
Active