461 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This test is used to determine the effects of constant acceleration on microelectronic devices. It is an accelerated test designed to indicate types of structural and...
DLA
Method
4 /
Active
The purpose of this test is to measure the output noise ratio of a mixer diode.
DLA
Method
2 / w/Change3
Active
The purpose of this test is to determine the thermal characteristics of microelectronic devices. This includes junction temperature, thermal resistance, case and...
DLA
Method
1 /
Active
The purpose of this test is to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements of the...
DLA
Method
10 /
Active
The purpose of this test is to determine the effect on the device of vibration in the frequency range specified.
DLA
Method
2 /
Active
The purpose of this test is to determine the axial tensile load which can be applied to a mated pair of connectors and the holding effect of a connector cable clamp...
DLA
Method
1 / A
Cancelled
The moisture resistance test is performed for the purpose of evaluating, in an accelerated manner, the resistance of component parts and constituent materials to the...
DLA
Method
/
Active
This method establishes the requirements for the lot acceptance testing of microcircuit wafers intended for class level S use.
DLA
Method
8 /
Active
The purpose of this test is to deternine the effecls of a controlled salt laden atmosphere on electrical connector components, finishes, Mechanisms and permit...
DLA
Method
1 / A
Cancelled
To verify that markings or color coding will not become illegible or discolored on the parts (including printed wiring boards) when subjected to solvents and processes...
DLA
Method
/ w/Change 1
Active