461 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test is to measure the holding current of the device under the specified conditions.
DLA
Method
2 / w/Change3
Active
The purpose of this test is to measure the noise figure of the device under the specified conditions.
DLA
Method
1 / w/Change1
Active
This method establishes the means for measuring the power dissipation and output impedance.
DLA
Method
1 /
Active
This method provides means for establishing or evaluating the maximum capabilities of microelectronic devices, including such capabilities as absolute maximum ratings...
DLA
Method
/
Active
The purpose of this test is to measure the SWR of the device at the local oscillator terminals.
DLA
Method
1 / w/Change3
Active
This method provides a test for determining the integrity of solder column type package leads by measuring the capability of the package column to withstand an axial...
DLA
Method
/
Active
The purpose of this test is to define a method for verifying the inductive switching SOA for MOS gated power transistors and to assure devices are free from latch up.
DLA
Method
/ w/Change1
Active
This test method is performed for the purpose of detecting malfunctions of semiconductor devices during vibration in the specified frequency range at the specified...
DLA
Method
4 / A w/Change5
Active
The purpose of this test is to determine the thermal performance of diode devices. This can be done in two ways, steady-state thermal impedance or transient thermal...
DLA
Method
5 / w/Change1
Active
This test method establishes the XRF scan locations, guidance, and sampling plans for the semiconductor device package styles shown.
DLA
Method
/ A w/Change4
Active