461 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test is to determine the thermal resistance of lead, case, or surface mounted diodes under the specified conditions.
DLA
Method
4 / w/Change3
Active
This test determines the ability of component parts and subassemblies of electrical and electronic components to withstand shocks.
DLA
Method
E /
Canceled
Both the IS-139ASRH and IS-139ASEH are wafer-by-wafer assurance tested per MIL-STD-883H at 300krad(Si) of HDR (50 to 300 rad(Si)/s. Only the IS-139ASEH is...
TD
/ 0.00
Active
This method establishes the minimum inspection procedures and acceptance criteria for polymeric materials used in microcircuit applications.
DLA
Method
7 /
Active
The purpose of this test is to measure the forward blocking current under the specified conditions, using the dc method or the ac method, as applicable.
DLA
Method
1 / w/Change3
Active
The purpose of this test is to measure the detector power efficiency.
DLA
Method
/ w/Change3
Active
This test is conducted for the purpose of determining the effects on electrical and mechanical characteristics of a part, resulting from exposure of the part to an...
DLA
Method
/
Active
The purpose of this test is to measure the value of the small signal series inductance under the specified conditions.
DLA
Method
/ w/Change3
Active
The purpose of this test method is to determine the solderability of all ribbon leads up to 0.050 inch (1.27 mm) in width and up to 0.025 inch (0.64 mm) in thickness...
DLA
Method
3 /
Active
The purpose of this test method is to determine the solderability of all terminations which are normally joined by a soldering operation.
DLA
Method
A /
Active