460 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test is to measure the output admittance of the device under the specified conditions.
DLA
Method
/ w/Change1
Active
The purpose of this test is to determine compliance with the specified sample plan for semiconductor devices subjected to the specified conditions.
DLA
Method
2 / A w/Change4
Active
The purpose of this test is to measure the overall noise figure of a mixer diode and the noise figure of the associated IF amplifier.
DLA
Method
2 / w/Change3
Active
The random-drop test is used to determine the effects on component parts of random, repeated impact due to handling, shipping, and other field service conditions.
DLA
Method
/ A w/Change5
Active
The purpose of this test is to detect the presence of free moving particulate contaminants within sealed cavity devices. This test method is specifically directed...
DLA
Method
/
Active
This test is performed to determine whether wire and other component parts can withstand the effects of the heat to which they will be subjected during the soldering...
DLA
Method
/
Active
This test defines the basic test circuitry and waveform definitions by which to measure the total switching losses of an IGBT.
DLA
Method
1 / w/Change1
Active
This method establishes the means for measuring the output transition times of digital microelectronic devices, such as TTL, DTL, RTL, ECL, and MOS.
DLA
Method
1 /
Active
The purpose of this test is to measure the real part of the impedance at the IF output terminals of the mixer diode under test.
DLA
Method
1 / w/Change3
Active
This section describes detailed requirements for a DPA of commonly used resistors. These requirements supplement the general requirements in section 4.
DLA
Method
/ C
Active