460 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This method provides a test for determining the integrity of solder column type package leads by measuring the capability of the package column to withstand an axial...
DLA
Method
/
Active
The purpose of this test is to define a method for verifying the inductive switching SOA for MOS gated power transistors and to assure devices are free from latch up.
DLA
Method
/ w/Change1
Active
This test method is performed for the purpose of detecting malfunctions of semiconductor devices during vibration in the specified frequency range at the specified...
DLA
Method
4 / A w/Change5
Active
The purpose of this test is to determine the thermal performance of diode devices. This can be done in two ways, steady-state thermal impedance or transient thermal...
DLA
Method
5 / w/Change1
Active
This test method establishes the XRF scan locations, guidance, and sampling plans for the semiconductor device package styles shown.
DLA
Method
/ A w/Change4
Active
This test method is designed to check the capabilities of the semiconductor device leads, welds and seals to withstand a straight pull.
DLA
Method
5 / A w/Change5
Active
The purpose of this test is to determine if the breakdown voltage of the device under the specified conditions is greater than the specified minimum limit.
DLA
Method
2 / w/Change1
Active
The purpose of this test is to measure the static transconductance of the device under the specified conditions.
DLA
Method
1 / w/Change1
Active
The purpose of this test is to measure the cutoff current of the device under the specified conditions.
DLA
Method
2 / w/Change1
Active
The purpose of this test is to measure the saturation voltage and resistance of the device under the specified conditions.
DLA
Method
/ w/Change1
Active