460 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test is to measure the input resistance of the device under the specified conditions.
DLA
Method
1 / w/Change1
Active
The purpose of this test is to measure the gate reverse current of the field effect transistor or IGBT under the specified conditions.
DLA
Method
1 / w/Change1
Active
This test is conducted to determine the suitability of connectors and connector assemblies when subjected to shocks such as those expected from rough handling,...
DLA
Method
1 / A
Cancelled
The purpose of this test is to determine the thermal resistance of lead, case, or surface mounted diodes under the specified conditions.
DLA
Method
4 / w/Change3
Active
This test determines the ability of component parts and subassemblies of electrical and electronic components to withstand shocks.
DLA
Method
E /
Canceled
Both the IS-139ASRH and IS-139ASEH are wafer-by-wafer assurance tested per MIL-STD-883H at 300krad(Si) of HDR (50 to 300 rad(Si)/s. Only the IS-139ASEH is...
TD
/ 0.00
Active
This method establishes the minimum inspection procedures and acceptance criteria for polymeric materials used in microcircuit applications.
DLA
Method
7 /
Active
The purpose of this test is to measure the forward blocking current under the specified conditions, using the dc method or the ac method, as applicable.
DLA
Method
1 / w/Change3
Active
The purpose of this test is to measure the detector power efficiency.
DLA
Method
/ w/Change3
Active
This test is conducted for the purpose of determining the effects on electrical and mechanical characteristics of a part, resulting from exposure of the part to an...
DLA
Method
/
Active