460 results found for MIL-STD

This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to terminal capacitance....

This section describes detailed requirements for a DPA of commonly used thermistors. These requirements supplement the general requirements in section 4.

These procedures and criteria shall address probe testing and lot acceptance testing, element evaluation or equivalent for each wafer, or wafer lot as applicable...

This test is to measure the resistance offered by the insulating members of a component part to an impressed direct voltage tending to produce a leakage of current...

The purpose of this test is to measure the output admittance of the field-effect transistor under the specified small-signal conditions.

The purpose of this test is to measure the quality factor, commonly called Q, of electronic parts such as capacitors and inductors.

This is an internal visual inspection for use in destructive physical analysis (DPA) procedures. The purpose of this destructive test is to examine devices opened for...

The purpose of this test is to measure the reverse blocking current under the specified conditions, using the dc method or the ac method, as applicable.

High dose rate testing to 300 krad(Si) . Low dose rate testing to 150 krad(Si) . The high dose rate irradiations were done at 65 rad(Si)/s and the low dose rate work...

The purpose of this test is to detect the presence of moisture trapped inside the microelectronic device package in sufficient quantity to adversely affect device...