460 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test method is to establish the integrity of the semiconductor die attachment to the package header or other substrate.
DLA
Method
3 / A w/Change5
Active
DLA
Detail / Drawing
C / -
Active
DLA
Detail / Drawing
F / -
Active
The purpose of this test method is to visually inspect glass–encased, double plug, noncavity, axial leaded semiconductor devices for cracks which may affect the...
DLA
Method
1 / A w/Change5
Active
The purpose of this test method is to verify the construction and quality of workmanship in wafer, wafer dc testing, die inspection, and assembly processes to the...
DLA
Method
2 / A w/Change5
Active
The purpose of this test is to simulate stresses imposed on a surface mount device (SMD) during installation, operation, removal, and rework.
DLA
Method
1 / A w/Change5
Active
DLA
Detail / Drawing
B / -
Active
DLA
Detail / Drawing
D / -
Active
DLA
Detail / Drawing
C / -
Active
DLA
Detail / Drawing
F / -
Active