461 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This describes a test method for subjecting the device under test (DUT) to a high power stress condition in the reverse direction of rectifiers to determine the...
DLA
Method
/ w/Change3
Active
The purpose of this test is to determine the forces required to engage and separate standard test pins or blade with individual contacts
DLA
Method
/ A
Cancelled
The purpose of this test method is to determine the effectiveness of the seal of a component part which has an internal cavity which is either evacuated or contains...
DLA
Method
/
Active
The purpose of this test is to determine the ratio of the available RF input power to the available IF output power under specified conditions.
DLA
Method
3 / w/Change3
Active
The purpose of this test is to measure the resistive component of the small-signal, short-circuit input impedance of the device under the specified conditions.
DLA
Method
/ w/Change1
Active
The purpose of this test is to determine the effects on the electrical and mechanical characteristics of electrical connectors resultings from exposure of the...
DLA
Method
1 / A
Cancelled
The purpose of this test method is to measure the reverse current leakage through a device at a specified reverse voltage using a dc method or an ac method, as...
DLA
Method
5 / w/Change3
Active
The purpose of this test method is to measure the turn-off time of the device under the specified conditions.
DLA
Method
/ w/Change3
Active
The purpose of this test is to determine a representative failure rate for microelectronic devices or to demonstrate quality or reliability of devices subjected to the...
DLA
Method
1 /
Active
The low dose rate work was performed at 0.10rad(Si)/s and the hig dose rate work was performed at 60rad(Si)/sper MIL-STD-883 Method 1019 as part of the Intersil wafer...
TD
/ 0
Active