461 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test method is to detect loose particles inside a semiconductor device cavity. The test provides a nondestructive means of identifying those...
DLA
Method
5 / A w/Change5
Active
The purpose of this test method is to check the physical dimensions of the semiconductor device.
DLA
Method
/ A w/Change5
Active
DLA
Detail / Drawing
M / -
Active
DLA
Detail / Drawing
E / -
Active
The purpose of this test method is to provide a referee condition for the evaluation of the solderability of terminations (including leads up to .125 inch (3.18 mm) in...
DLA
Method
13 / A w/Change5
Active
The constant acceleration test is used to determine the effect on semiconductor devices of a centrifugal force.
DLA
Method
2 / A w/Change5
Active
This test method describes procedures and evaluation guidelines for the destructive physical analysis (DPA) of wire bonded semiconductor devices.
DLA
Method
2 / A w/Change4
Active
The purpose of this test method is to verify the construction and workmanship of bipolar transistors, field effect transistors (FET), discrete monolithic, multichip,...
DLA
Method
9 / A w/Change4
Active
The purpose of this test method is to verify the construction and workmanship of semiconductor devices utilizing junction passivated diode and rectifiers chips that...
DLA
Method
1 / A w/Change4
Active
Test Site Transfer of RH, SMD, Class-S, Special flow and MIL-STD-883 products from Analog Devices Milpitas to Analog Devices General Trias (ADGT), Philippines
Alert Documents
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Active