460 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test is to determine the thermal performance of transistor devices. This can be done in two ways, steady-state thermal impedance or thermal...
DLA
Method
6 / w/Change1
Active
The purpose of this test is to measure the thermal resistance of the device under the specified conditions.
DLA
Method
/ w/Change1
Active
DLA
Detail / Drawing
A / -
Active
This test method is intended to determine the ability of the semiconductor devices to withstand moderately severe shocks such as would be produced by rough handling,...
DLA
Method
2 / A w/Change5
Active
Aeroflex is proceeding with migrating the UT63M147 MIL-STD-1553A/B Bus Transceivers (5962-93226), to a new wafer fabrication facility. As a result of the wafer foundry...
Alert Documents
18/07/2018 /
Active
The purpose of this test is to measure the base to emitter voltage of the device in either a saturated or nonsaturated condition.
DLA
Method
1 / w/Change1
Active
The purpose of this test is to measure the time required for the junction to reach 63.2 percent of the final value of TJ change following application of a step...
DLA
Method
1 / w/Change1
Active
The purpose of this test is to measure the input resistance of the device under the specified conditions.
DLA
Method
1 / w/Change1
Active
The purpose of this test is to measure the gate reverse current of the field effect transistor or IGBT under the specified conditions.
DLA
Method
1 / w/Change1
Active
This test is conducted to determine the suitability of connectors and connector assemblies when subjected to shocks such as those expected from rough handling,...
DLA
Method
1 / A
Cancelled