125 results found for MIL-STD-883
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test is to determine the strength of the element attachment system when subjected to force in the Y1 axis. This method is applicable to...
DLA
Method
2 /
Active
The thin film corrosion test is performed for the purpose of demonstrating the quality or reliability of devices subjected to the specified conditions over a specified...
DLA
Method
/
Active
The purpose of this method is to define a technique for assuring a conformance to a maximum or minimum mean of a parameter measured in any test method listed in...
DLA
Method
/
Active
This method establishes screening, qualification, and quality conformance requirements for the testing of complex monolithic microcircuits to assist in achieving the...
DLA
Method
4 /
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable
DLA
Method
/
Active
This method establishes the means for measuring power supply currents of digital microelectronic devices such as TTL, DTL, RTL, ECL, and MOS.
DLA
Method
1 /
Active
This destructive test is intended to determine the integrity of all primary and undercoat lead finishes.
DLA
Method
4 /
Active
The purpose of this test is to measure the strength of internal bonds between a semiconductor die and a substrate to which it is attached in a face-bond configuration
DLA
Method
1 /
Active
total dose test of the IS-2981EH octal source driver. Parts were irradiated to 200 krad(Si) at low dose rate under biased and unbiased conditions as outlined in...
TD
/ 0
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to output short circuit...
DLA
Method
1 /
Active