125 results found for MIL-STD-883

The purpose of this method is to reveal nonacceptable wire bonds while avoiding damage to acceptable wire bonds.

The purpose of this examination is to nondestructively detect unbonded regions, delaminations and/or voids in the die attach material and at interfaces within devices...

The purpose of preseal burn-in is to identify marginal devices or stabilize monolithic, hybrid, or multichip microcircuits prior to the sealing of packages so that...

This method establishes the means of measuring the level of cross-coupling of wideband digital signals and noise between pins in a digital microcircuit package.

The purpose of this test is to inspect passive elements used for microelectronic applications, including RF/microwave, for the visual defects described herein.

This method establishes the means for assuring device performance to the limits specified in the applicable acquisition document in regard to input and output...

The purpose of this test is to determine a representative failure rate for microelectronic devices or to demonstrate quality or reliability of devices subjected to the...

The low dose rate work was performed at 0.10rad(Si)/s and the hig dose rate work was performed at 60rad(Si)/sper MIL-STD-883 Method 1019 as part of the Intersil wafer...

The purpose of this method is to detect unbonded and insufficiently bonded sites in TAB (Tape automated bonding) devices in the open package condition, through the...

The barometric-pressure test is performed under conditions simulating the low atmospheric pressure encountered in the nonpressurized portions of aircraft and other...