125 results found for MIL-STD-883
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
Method 5008 is canceled effective 1 June 1993. It is superseded by MIL-PRF-38534. For Federal Stock classes other than 5962, the following paragraphs of MIL-PRF-38534...
DLA
Method
9 /
Cancelled
Samples were tested at low and high dose rate under biased and unbiased conditions, as outlined in MIL-STD-883 Test Method 1019, to a total dose of 100krad(Si) at LDR...
TD
/
Active
This method establishes the means for measuring the power dissipation and output impedance.
DLA
Method
1 /
Active
This method provides means for establishing or evaluating the maximum capabilities of microelectronic devices, including such capabilities as absolute maximum ratings...
DLA
Method
/
Active
This method provides a test for determining the integrity of solder column type package leads by measuring the capability of the package column to withstand an axial...
DLA
Method
/
Active
The purpose of this test is to detect loose particles inside a device cavity. The test provides a nondestructive means of identifying those devices containing...
DLA
Method
9 /
Active
The purpose of this test procedure is to measure small signal power gain and the noise figure of an amplifier.
DLA
Method
2 /
Active
This test procedure defines the requirements for testing the response of packaged digital integrated circuits to pulsed ionizing radiation.
DLA
Method
3 /
Active
The purpose of this method is to reveal nonacceptable wire bonds while avoiding damage to acceptable wire bonds.
DLA
Method
7 /
Active
The purpose of this examination is to nondestructively detect unbonded regions, delaminations and/or voids in the die attach material and at interfaces within devices...
DLA
Method
2 /
Active