125 results found for MIL-STD-883
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This destructive test is intended to determine the integrity of all primary and undercoat lead finishes.
DLA
Method
4 /
Active
The purpose of this test is to measure the strength of internal bonds between a semiconductor die and a substrate to which it is attached in a face-bond configuration
DLA
Method
1 /
Active
total dose test of the IS-2981EH octal source driver. Parts were irradiated to 200 krad(Si) at low dose rate under biased and unbiased conditions as outlined in...
TD
/ 0
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to output short circuit...
DLA
Method
1 /
Active
The purpose of this examination is to verify that internal materials, design and construction are in accordance with the applicable acquisition document.
DLA
Method
/
Active
The purpose of this test method is to measure strengths of bonds external to leadless microelectronic packages (e.g., solder bonds from chip carrier terminals to...
DLA
Method
1 /
Active
Product was not tested correctly for Constant Acceleration requirement per MIL-STD-883 TM2001 Condition E
Alert Documents
/
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document with regard to LOW level output drive...
DLA
Method
1 /
Active
This test procedure specifies the methods by which fault coverage is reported for a test program applied to a microcircuit herein referred to as the device under test...
DLA
Method
1 /
Active
The purpose of this test is to determine the effect on microelectronic devices of storage at elevated temperatures without electrical stress applied.
DLA
Method
2 /
Active