125 results found for MIL-STD-883
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This method provides a test for determining the integrity of pin-grid type package leads by measuring the capability of the package leads to withstand an axial force.
DLA
Method
4 /
Active
HS1840ARH 16-channel. Parts were tested at low and high dose rate under biased and unbiased conditions as outlined in MIL-STD-883 Test Method 1019.7, to a maximum...
TD
/ 0
Active
total dose test of the HS-OP470ARH.Parts were tested at low and high dose rate under biased and unbiased conditions as outlined in MIL-STD-883 Test Method 1019.7,to a...
TD
/ 0
Active
The purpose of this test is to check the internal materials, construction, and workmanship of microcircuits for compliance with the requirements of the applicable...
DLA
Method
14 /
Active
This test is to measure the resistance offered by the insulating members of a component part to an impressed direct voltage tending to produce a leakage of current...
DLA
Method
/
Active
The purpose of this test is to verify that the markings will not become illegible on the component parts when subjected to solvents.
DLA
Method
14 /
Active
The steady-state life test is performed for the purpose of demonstrating the quality or reliability of devices subjected to the specified conditions over an extended...
DLA
Method
11 /
Active
This method establishes the means for measuring the stability and slew rate of a linear amplifier intended to be used with feedback.
DLA
Method
1 /
Active
The purpose of this test is to determine the shear strength of the seal of glass-frit-sealed microelectronic packages. This is a destructive test.
DLA
Method
2 /
Active
The shock test is intended to determine the suitability of the devices for use in electronic equipment which may be subjected to moderately severe shocks as a result...
DLA
Method
5 /
Active