125 results found for MIL-STD-883
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This method establishes the means for measuring the stability and slew rate of a linear amplifier intended to be used with feedback.
DLA
Method
1 /
Active
The purpose of this test is to determine the shear strength of the seal of glass-frit-sealed microelectronic packages. This is a destructive test.
DLA
Method
2 /
Active
The shock test is intended to determine the suitability of the devices for use in electronic equipment which may be subjected to moderately severe shocks as a result...
DLA
Method
5 /
Active
The purpose of this test is to describe requirements for performance of destructive physical analysis (DPA) for the applicable device class, for sampling, preparation,...
DLA
Method
1 /
Active
The burn-in test is performed for the purpose of screening or eliminating marginal devices, those with inherent defects or defects resulting from manufacturing...
DLA
Method
12 /
Active
The thin film corrosion test is performed for the purpose of demonstrating the quality or reliability of devices subjected to the specified conditions over a specified...
DLA
Method
/
Active
The purpose of this method is to define a technique for assuring a conformance to a maximum or minimum mean of a parameter measured in any test method listed in...
DLA
Method
/
Active
This method establishes screening, qualification, and quality conformance requirements for the testing of complex monolithic microcircuits to assist in achieving the...
DLA
Method
4 /
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable
DLA
Method
/
Active
This method establishes the means for measuring power supply currents of digital microelectronic devices such as TTL, DTL, RTL, ECL, and MOS.
DLA
Method
1 /
Active