125 results found for MIL-STD-88
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This method establishes the requirements for the lot acceptance testing of microcircuit wafers intended for class level S use.
DLA
Method
8 /
Active
This method establishes qualification and quality conformance inspection procedures for microelectronics to assure that the device and lot quality conforms with the...
DLA
Method
17 /
Active
The purpose of this test method is to quantitatively measure the gas atmosphere inside a metal or ceramic hermetically-sealed device using mass spectrometry methods.
DLA
Method
10 /
Active
This method establishes a means for assuring circuit performance during cold temperature start up. It defines an activation time for digital microelectronic devices...
DLA
Method
1 /
Active
This test method is performed to determine whether termination leads and other component parts can withstand the effects of the heat to which they will be subjected...
DLA
Method
1 /
Active
The purpose of this test is to detect loose particles inside a device cavity. The test provides a nondestructive means of identifying those devices containing...
DLA
Method
9 /
Active
The purpose of this test procedure is to measure small signal power gain and the noise figure of an amplifier.
DLA
Method
2 /
Active
This test procedure defines the requirements for testing the response of packaged digital integrated circuits to pulsed ionizing radiation.
DLA
Method
3 /
Active
The purpose of this method is to reveal nonacceptable wire bonds while avoiding damage to acceptable wire bonds.
DLA
Method
7 /
Active
The purpose of this examination is to nondestructively detect unbonded regions, delaminations and/or voids in the die attach material and at interfaces within devices...
DLA
Method
2 /
Active