125 results found for MIL-STD-88

This is an internal visual inspection for use in destructive physical analysis (DPA) procedures. The purpose of this destructive test is to examine devices opened for...

High dose rate testing to 300 krad(Si) . Low dose rate testing to 150 krad(Si) . The high dose rate irradiations were done at 65 rad(Si)/s and the low dose rate work...

The purpose of this test is to detect the presence of moisture trapped inside the microelectronic device package in sufficient quantity to adversely affect device...

The intermittent life test is performed for the purpose of determining a representative failure rate for microelectronic devices or demonstrating quality or...

The moisture resistance test is performed for the purpose of evaluating, in an accelerated manner, the resistance of component parts and constituent materials to the...

The purpose of this test is to visually inspect the internal materials, construction, and workmanship of hybrid, multichip and multichip module microcircuits.

This test procedure defines the requirements for measuring the dose rate response and upset threshold of packaged devices containing analog functions when exposed to...

This test is performed to determine the effectiveness of the seal of microelectronic devices.

This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to LOW level input load...

This method establishes the means for measuring MOSFET threshold voltage. This method applies to both enhancement-mode and depletion-mode MOSFETs, and for both silicon...