125 results found for MIL-STD-88
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test is to detect loose particles inside a device cavity. The test provides a nondestructive means of identifying those devices containing...
DLA
Method
9 /
Active
The purpose of this test procedure is to measure small signal power gain and the noise figure of an amplifier.
DLA
Method
2 /
Active
This test procedure defines the requirements for testing the response of packaged digital integrated circuits to pulsed ionizing radiation.
DLA
Method
3 /
Active
The purpose of this method is to reveal nonacceptable wire bonds while avoiding damage to acceptable wire bonds.
DLA
Method
7 /
Active
The purpose of this examination is to nondestructively detect unbonded regions, delaminations and/or voids in the die attach material and at interfaces within devices...
DLA
Method
2 /
Active
The purpose of preseal burn-in is to identify marginal devices or stabilize monolithic, hybrid, or multichip microcircuits prior to the sealing of packages so that...
DLA
Method
2 /
Active
This method establishes the means of measuring the level of cross-coupling of wideband digital signals and noise between pins in a digital microcircuit package.
DLA
Method
/
Active
The purpose of this test is to inspect passive elements used for microelectronic applications, including RF/microwave, for the visual defects described herein.
DLA
Method
3 /
Active
This method establishes the means for assuring device performance to the limits specified in the applicable acquisition document in regard to input and output...
DLA
Method
1 /
Active
The purpose of this test is to determine a representative failure rate for microelectronic devices or to demonstrate quality or reliability of devices subjected to the...
DLA
Method
1 /
Active