125 results found for MIL-STD-88

The low dose rate work was performed at 0.10rad(Si)/s and the hig dose rate work was performed at 60rad(Si)/sper MIL-STD-883 Method 1019 as part of the Intersil wafer...

This method provides various tests for determining the integrity of microelectronic device leads (terminals), welds, and seals.

The purpose of this test method is to provide a referee condition for the evaluation of the solderability of terminations (including leads up to 0.125 inch in...

This method establishes the means of evaluating the characteristic impedance, capacitance, and delay time of signal lines in packages used for high frequency digital...

The purpose of the life characterization tests is to determine: (1) the life distributions, (2) the life acceleration characteristics, and (3) the failure rate (λ)...

This method established the means for measuring propagation delay of digital microelectronic devices, such as TTL, DTL, RTL, ECL, and MOS.

This method establishes the means of measuring the series impedance of the ground and power supply circuit pin configurations for packages used for complex, wide...

The purpose of this method is to define a technique for assuring a normal distribution for any test method listed in the 3000 or 4000 series of this standard. This...

This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to HIGH level input load...

Both the IS-139ASRH and IS-139ASEH are wafer-by-wafer assurance tested per MIL-STD-883H at 300krad(Si) of HDR (50 to 300 rad(Si)/s. Only the IS-139ASEH is...