125 results found for MIL-STD-88
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
Both the IS-139ASRH and IS-139ASEH are wafer-by-wafer assurance tested per MIL-STD-883H at 300krad(Si) of HDR (50 to 300 rad(Si)/s. Only the IS-139ASEH is...
TD
/ 0.00
Active
This method establishes the minimum inspection procedures and acceptance criteria for polymeric materials used in microcircuit applications.
DLA
Method
7 /
Active
The purpose of this test method is to determine the solderability of all ribbon leads up to 0.050 inch (1.27 mm) in width and up to 0.025 inch (0.64 mm) in thickness...
DLA
Method
3 /
Active
This method establishes the means for measuring the automatic gain control range of a linear amplifier.
DLA
Method
/
Active
Method 5008 is canceled effective 1 June 1993. It is superseded by MIL-PRF-38534. For Federal Stock classes other than 5962, the following paragraphs of MIL-PRF-38534...
DLA
Method
9 /
Cancelled
Samples were tested at low and high dose rate under biased and unbiased conditions, as outlined in MIL-STD-883 Test Method 1019, to a total dose of 100krad(Si) at LDR...
TD
/
Active
This method establishes the means for measuring the power dissipation and output impedance.
DLA
Method
1 /
Active
This method provides means for establishing or evaluating the maximum capabilities of microelectronic devices, including such capabilities as absolute maximum ratings...
DLA
Method
/
Active
This method provides a test for determining the integrity of solder column type package leads by measuring the capability of the package column to withstand an axial...
DLA
Method
/
Active
The thin film corrosion test is performed for the purpose of demonstrating the quality or reliability of devices subjected to the specified conditions over a specified...
DLA
Method
/
Active