125 results found for MIL-STD-88

The purpose of this test is to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements of the...

The purpose of this test is to determine the effect on the device of vibration in the frequency range specified.

This method establishes the requirements for the lot acceptance testing of microcircuit wafers intended for class level S use.

This method establishes qualification and quality conformance inspection procedures for microelectronics to assure that the device and lot quality conforms with the...

The purpose of this test method is to quantitatively measure the gas atmosphere inside a metal or ceramic hermetically-sealed device using mass spectrometry methods.

This method establishes a means for assuring circuit performance during cold temperature start up. It defines an activation time for digital microelectronic devices...

This test method is performed to determine whether termination leads and other component parts can withstand the effects of the heat to which they will be subjected...

This method established the means for measuring propagation delay of digital microelectronic devices, such as TTL, DTL, RTL, ECL, and MOS.

This method establishes the means of measuring the series impedance of the ground and power supply circuit pin configurations for packages used for complex, wide...

The purpose of this method is to define a technique for assuring a normal distribution for any test method listed in the 3000 or 4000 series of this standard. This...