125 results found for MIL-STD-88
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The intermittent life test is performed for the purpose of determining a representative failure rate for microelectronic devices or demonstrating quality or...
DLA
Method
/
Active
The moisture resistance test is performed for the purpose of evaluating, in an accelerated manner, the resistance of component parts and constituent materials to the...
DLA
Method
7 /
Active
The purpose of this test is to visually inspect the internal materials, construction, and workmanship of hybrid, multichip and multichip module microcircuits.
DLA
Method
13 /
Active
This test procedure defines the requirements for measuring the dose rate response and upset threshold of packaged devices containing analog functions when exposed to...
DLA
Method
3 /
Active
This test is performed to determine the effectiveness of the seal of microelectronic devices.
DLA
Method
/
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to LOW level input load...
DLA
Method
1 /
Active
This method establishes the means for measuring MOSFET threshold voltage. This method applies to both enhancement-mode and depletion-mode MOSFETs, and for both silicon...
DLA
Method
/
Active
The purpose of this test is to determine the effectiveness (hermeticity) of the seal of microelectronic devices with designed internal cavities.
DLA
Method
17 /
Active
The purpose of this test is to assess the structural quality of deposited dielectric films (e.g., CVD, sputtered or electron beam evaporated glass or nitride, etc.)...
DLA
Method
3 /
Active
Qualify TeamQuest Technology, Inc.as an additional site for Burn-in and Group C High Temp Operating Life Test (HTOL) processes for Military and Aerospace products...
Alert Documents
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Active