125 results found for MIL-STD-88

This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to HIGH level input load...

Both the IS-139ASRH and IS-139ASEH are wafer-by-wafer assurance tested per MIL-STD-883H at 300krad(Si) of HDR (50 to 300 rad(Si)/s. Only the IS-139ASEH is...

This method tests the capability of a Plastic Encapsulated Microcircuit (PEM) to withstand moisture ingress and to detect flaws in packaging materials.

This method establishes the means for assuring circuit performance in regard to the test requirements necessary to verify the specified function and to assure that all...

This method provides a means of judging the quality and acceptability of device interconnect metallization on non-planar oxide integrated circuit wafers or dice.

This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to output leakage current...

This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to HIGH level input load...

The purpose of this test is to measure the amount of electrical noise produced by the device under vibration.

This test method defines the procedure for testing integrated circuits under known test conditions for susceptibility to alpha induced errors.

This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to output leakage current...