125 results found for MIL-STD-88

This test method is performed to determine whether termination leads and other component parts can withstand the effects of the heat to which they will be subjected...

This method established the means for measuring propagation delay of digital microelectronic devices, such as TTL, DTL, RTL, ECL, and MOS.

This method establishes the means of measuring the series impedance of the ground and power supply circuit pin configurations for packages used for complex, wide...

The purpose of this method is to define a technique for assuring a normal distribution for any test method listed in the 3000 or 4000 series of this standard. This...

This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to HIGH level input load...

Both the IS-139ASRH and IS-139ASEH are wafer-by-wafer assurance tested per MIL-STD-883H at 300krad(Si) of HDR (50 to 300 rad(Si)/s. Only the IS-139ASEH is...

This method tests the capability of a Plastic Encapsulated Microcircuit (PEM) to withstand moisture ingress and to detect flaws in packaging materials.

This method establishes the means for assuring circuit performance in regard to the test requirements necessary to verify the specified function and to assure that all...

This method provides a means of judging the quality and acceptability of device interconnect metallization on non-planar oxide integrated circuit wafers or dice.

This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to output leakage current...