125 results found for MIL-STD-883
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test is to measure the amount of electrical noise produced by the device under vibration.
DLA
Method
1 /
Active
This test method defines the procedure for testing integrated circuits under known test conditions for susceptibility to alpha induced errors.
DLA
Method
1 /
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to output leakage current...
DLA
Method
/
Active
The purpose of this test is to determine the resistance of the part to sudden exposure to extreme changes in temperature and the effect of alternate exposures to these...
DLA
Method
9 /
Active
This test is conducted for the purpose of determining the ability of the microcircuit; to withstand the dynamic stress exerted by random vibration applied between...
DLA
Method
/
Active
This method specifies wafer fabrication control and wafer acceptance requirements for GaAs monolithic microcircuits for application in class level B or class level S...
DLA
Method
1 /
Active
Failure analysis is a post mortem examination of failed devices employing, as required, electrical measurements and many of the advanced analytical techniques of...
DLA
Method
/
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to HIGH level output drive,...
DLA
Method
1 /
Active
This method establishes screening procedures for total lot screening of microelectronics to assist in achieving levels of quality and reliability commensurate with the...
DLA
Method
13 /
Active
This test procedure defines the detailed requirements for performing latchup testing of microcircuits to identify susceptibility to dose rate induced latchup.
DLA
Method
1 /
Active