125 results found for MIL-STD-883
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test is to measure the amount of electrical noise produced by the device under vibration.
DLA
Method
1 /
Active
This test method defines the procedure for testing integrated circuits under known test conditions for susceptibility to alpha induced errors.
DLA
Method
1 /
Active
This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to output leakage current...
DLA
Method
/
Active
The purpose of this test is to determine the resistance of the part to sudden exposure to extreme changes in temperature and the effect of alternate exposures to these...
DLA
Method
9 /
Active
Both the IS-139ASRH and IS-139ASEH are wafer-by-wafer assurance tested per MIL-STD-883H at 300krad(Si) of HDR (50 to 300 rad(Si)/s. Only the IS-139ASEH is...
TD
/ 0.00
Active
This method establishes the minimum inspection procedures and acceptance criteria for polymeric materials used in microcircuit applications.
DLA
Method
7 /
Active
The purpose of this test method is to determine the solderability of all ribbon leads up to 0.050 inch (1.27 mm) in width and up to 0.025 inch (0.64 mm) in thickness...
DLA
Method
3 /
Active
This method establishes the means for measuring the automatic gain control range of a linear amplifier.
DLA
Method
/
Active
Method 5008 is canceled effective 1 June 1993. It is superseded by MIL-PRF-38534. For Federal Stock classes other than 5962, the following paragraphs of MIL-PRF-38534...
DLA
Method
9 /
Cancelled
Samples were tested at low and high dose rate under biased and unbiased conditions, as outlined in MIL-STD-883 Test Method 1019, to a total dose of 100krad(Si) at LDR...
TD
/
Active