461 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The random-drop test is used to determine the effects on component parts of random, repeated impact due to handling, shipping, and other field service conditions.
DLA
Method
/ w/Change 1
Active
This section describes detailed requirements for a Prohibited Material Analysis of external and internal finishes of microelectronic parts and package materials. These...
DLA
Method
/ C
Active
DLA
Detail / Drawing
- / -
Active
Product was not tested correctly for Constant Acceleration requirement per MIL-STD-883 TM2001 Condition E
Alert Documents
/
Active
The purpose of this test method is to measure the amount of electrical noise produced by the semiconductor device under vibration.
DLA
Method
1 / A w/Change5
Active
DLA
Detail / Drawing
P / -
Active
The purpose of this test is to qualify the ability of a surface mount package of a semiconductor device to withstand the stresses developed by a thermal mismatch (due...
DLA
Method
/ A w/Change4
Active
The purpose of this test is to measure the forward-current transfer ratio of the device under the specified conditions.
DLA
Method
1 / w/Change1
Active
The purpose of this test is to verify the capability of a transistor to withstand switching between saturation and cutoff for various specified loads, establishing a SOA.
DLA
Method
/ w/Change1
Active
This test method defines the requirements for testing discrete packaged semiconductor devices for ionizing radiation (total dose) effects from a Cobalt-60 (60Co) gamma...
DLA
Method
6 / A w/Change4
Active