460 results found for MIL-STD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This method provides various tests for determining the integrity of microelectronic device leads (terminals), welds, and seals.
DLA
Method
7 /
Active
The purpose of this test method is to provide a referee condition for the evaluation of the solderability of terminations (including leads up to 0.125 inch in...
DLA
Method
13 /
Active
The purpose of this test is to determine the ability of an electrical comector to resist degradation when exposed to specific fIuids with which the connector may come...
DLA
Method
/ A
Cancelled
This method establishes the means of evaluating the characteristic impedance, capacitance, and delay time of signal lines in packages used for high frequency digital...
DLA
Method
/
Active
The purpose of the life characterization tests is to determine: (1) the life distributions, (2) the life acceleration characteristics, and (3) the failure rate (λ)...
DLA
Method
2 /
Active
The purpose of this test method is to establish the integrity of the semiconductor die attachment to the package header or other substrate.
DLA
Method
3 / A w/Change5
Active
DLA
Detail / Drawing
C / -
Active
DLA
Detail / Drawing
F / -
Active
The purpose of this test method is to visually inspect glass–encased, double plug, noncavity, axial leaded semiconductor devices for cracks which may affect the...
DLA
Method
1 / A w/Change5
Active
The purpose of this test method is to verify the construction and quality of workmanship in wafer, wafer dc testing, die inspection, and assembly processes to the...
DLA
Method
2 / A w/Change5
Active