208 results found for MIL-STD-750
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test method is to determine the effect on the semiconductor device of vibration in the frequency range specified.
DLA
Method
2 / A w/Change5
Active
Mechanical Test Methods for Semiconductor Devices Part 2: Bond strength (destructive bond pull test)
The purpose of this test method is to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements...
DLA
Method
1 / A w/Change5
Active
The purpose of this test is to measure the temperature rise per unit power dissipation of the designated junction above the case of the device or ambient temperature,...
DLA
Method
/ w/Change1
Active
The purpose of this test method is to detect loose particles inside a semiconductor device cavity. The test provides a nondestructive means of identifying those...
DLA
Method
5 / A w/Change5
Active
The purpose of this test method is to check the physical dimensions of the semiconductor device.
DLA
Method
/ A w/Change5
Active
The purpose of this test method is to provide a referee condition for the evaluation of the solderability of terminations (including leads up to .125 inch (3.18 mm) in...
DLA
Method
13 / A w/Change5
Active
The constant acceleration test is used to determine the effect on semiconductor devices of a centrifugal force.
DLA
Method
2 / A w/Change5
Active
This test method describes procedures and evaluation guidelines for the destructive physical analysis (DPA) of wire bonded semiconductor devices.
DLA
Method
2 / A w/Change4
Active
The purpose of this test method is to verify the construction and workmanship of bipolar transistors, field effect transistors (FET), discrete monolithic, multichip,...
DLA
Method
9 / A w/Change4
Active
The purpose of this test method is to verify the construction and workmanship of semiconductor devices utilizing junction passivated diode and rectifiers chips that...
DLA
Method
1 / A w/Change4
Active