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14721 results found for

Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status

MIL-STD-750, Method 2017

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Mechanical Test Methods for Semiconductor Devices Part 2: Die attach integrity
The purpose of this test method is to establish the integrity of the semiconductor die attachment to the package header or other substrate.
DLA
Method
3 / A w/Change5
Active

5962-90536

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Microcircuit, Linear, Dual High-Speed Current Feedback Operational Amplifier, Monolithic Silicon
DLA
Detail / Drawing
B / -
Active

MIL-PRF-6106/15

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Relays, Electromagnetic, 50 Amperes, DC, SPDT, Hermetically Sealed
DLA
Detail / Drawing
F / -
Active

5962-96801

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Microcircuit, Digital, Advanced High Speed CMOS Hex Schmitt-Trigger Inverter, TTL Compatible Inputs, Monolithic Silicon
DLA
Detail / Drawing
E / -
Active

5962-94667

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Microcircuit, Digital, Radiation Hardened, 1750 Chip Set, Multichip Microcircuit, Silicon
DLA
Detail / Drawing
- / -
Active

5962-89868

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Microcircuit, Linear, Positive, Adjustable, Voltage Regulator, Monolithic Silicon
DLA
Detail / Drawing
C / -
Active

5962-96563

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Microcircuit, Digital, Radiation Hardened, Advanced CMOS, Synchronous 4-Bit Up_Down BCD Decade Counter, TTL Compatible Inputs, Monolithic Silicon
DLA
Detail / Drawing
D / -
Active

5962-95703

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Microcircuit, Hybrid, Linear, +_-12 Volt, Dual Channel, DC_DC Converter
DLA
Detail / Drawing
E / -
Active

5962-88733

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Microcircuit, Digital, CMOS, 16 x 16 Bit Multiplier, Accumulator, Monolithioc Silicon
DLA
Detail / Drawing
D / -
Active

MIL-PRF-19500/139

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Semiconductor Device, Transistor, PNP, Silicon Type JAN - 2N1119 (Validation Notice)
DLA
Detail / Drawing
B /
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