2012 results found for MIL-STD-883 methods

Method 2008 is canceled effective 15 November 1974

The purpose of this test method is to quantitatively measure the gas atmosphere inside a metal or ceramic hermetically-sealed device using mass spectrometry...

This test procedure specifies the methods by which fault coverage is reported for a test program applied to a microcircuit herein referred to as the...

This method establishes the minimum inspection procedures and acceptance criteria for polymeric materials used in microcircuit applications.

This method provides a means of judging the quality and acceptability of device interconnect metallization on non-planar oxide integrated circuit wafers or dice.

This test method defines the procedure for testing integrated circuits under known test conditions for susceptibility to alpha induced errors.

The purpose of this test is to describe requirements for performance of destructive physical analysis (DPA) for the applicable device class, for sampling, preparation,...

The purpose of this test is to check the internal materials, construction, and workmanship of microcircuits for compliance with the requirements of the applicable...

This test procedure defines the requirements for testing packaged semiconductor integrated circuits for ionizing radiation (total dose) effects from a cobalt-60 (60Co)...

The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package...