1989 results found for MIL-STD-883 methods
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
Method 2008 is canceled effective 15 November 1974
DLA
Method
1 /
Supersed
The purpose of this test method is to quantitatively measure the gas atmosphere inside a metal or ceramic hermetically-sealed device using mass spectrometry...
DLA
Method
10 /
Active
This test procedure specifies the methods by which fault coverage is reported for a test program applied to a microcircuit herein referred to as the...
DLA
Method
1 /
Active
This method establishes the minimum inspection procedures and acceptance criteria for polymeric materials used in microcircuit applications.
DLA
Method
7 /
Active
This method provides a means of judging the quality and acceptability of device interconnect metallization on non-planar oxide integrated circuit wafers or dice.
DLA
Method
6 /
Active
This test method defines the procedure for testing integrated circuits under known test conditions for susceptibility to alpha induced errors.
DLA
Method
1 /
Active
The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package...
DLA
Method
10 /
Active
This method establishes screening procedures for total lot screening of microelectronics to assist in achieving levels of quality and reliability commensurate with the...
DLA
Method
13 /
Active
The purpose of the life characterization tests is to determine: (1) the life distributions, (2) the life acceleration characteristics, and (3) the failure rate (λ)...
DLA
Method
2 /
Active
This test procedure defines the detailed requirements for performing latchup testing of microcircuits to identify susceptibility to dose rate induced latchup.
DLA
Method
1 /
Active