269 results found for MIL-STD-883 method 2018
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test method is to verify the workmanship of packaged devices. This test method shall also be utilized to inspect for...
DLA
14 /
Active
This method provides a means of judging the quality and acceptability of device interconnect metallization on non-planar oxide integrated circuit wafers...
DLA
6 /
Active
The purpose of this test is to determine the effectiveness (hermeticity) of the seal of microelectronic devices with designed internal cavities.
DLA
17 /
Active
The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package...
DLA
10 /
Active
This method establishes the requirements for the lot acceptance testing of microcircuit wafers intended for class level S use.
DLA
8 /
Active
The purpose of this test method is to quantitatively measure the gas atmosphere inside a metal or ceramic hermetically-sealed device using mass...
DLA
10 /
Active
This method establishes the minimum inspection procedures and acceptance criteria for polymeric materials used in microcircuit applications.
DLA
7 /
Active
The purpose of this test is to describe requirements for performance of destructive physical analysis (DPA) for the applicable device class, for sampling, preparation,...
DLA
1 /
Active
The purpose of this test is to visually inspect the internal materials, construction, and workmanship of hybrid, multichip and multichip module microcircuits.
DLA
13 /
Active
The purpose of this examination is to nondestructively detect defects within the sealed case, especially those resulting from the sealing process, and internal defects...
DLA
11 /
Active