493 results found for MIL-STD-883, method 1014

The purpose of this test is to determine the effectiveness (hermeticity) of the seal of microelectronic devices with designed internal cavities.

This method provides various tests for determining the integrity of microelectronic device leads (terminals), welds, and seals.

This method establishes screening procedures for total lot screening of microelectronics to assist in achieving levels of quality and reliability...

The purpose of this test is to determine the resistance of the part to sudden exposure to extreme changes in temperature and the effect of alternate exposures to these...

The thin film corrosion test is performed for the purpose of demonstrating the quality or reliability of devices subjected to the specified conditions over a specified...

The purpose of this test method is to quantitatively measure the gas atmosphere inside a metal or ceramic hermetically-sealed device using mass...

This method establishes the minimum inspection procedures and acceptance criteria for polymeric materials used in microcircuit applications.

The purpose of this test is to describe requirements for performance of destructive physical analysis (DPA) for the applicable device class, for sampling, preparation,...

This test is conducted to determine the resistance of a part to extremes of high and low temperatures, and to the effect of alternate exposures to these extremes.

This method establishes qualification and quality conformance inspection procedures for microelectronics to assure that the device and lot quality...