123 results found for MIL-STD-883, Method 2022
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this test method is to determine the solderability of all ribbon leads up to 0.050 inch (1.27 mm) in width and up to 0.025 inch (0.64 mm)...
DLA
3 /
Active
This method provides a means of judging the quality and acceptability of device interconnect metallization on non-planar oxide integrated circuit wafers...
DLA
6 /
Active
MNFR
Detail / Drawing
2022-TS-005 / -
Active
ADI Commercial Space Products Program (April 2022)
Technical Note
April 2022 /
Active
MNFR
Detail / Drawing
2022-TS-003 / -
Active
MNFR
Detail / Drawing
2022-TS-004 / -
Active
This report provides the compliance matrix between the ECSS-Q-ST-60-13C standard against the Extended Lot Acceptance Test specifically implemented for the evaluation...
Qualification Report
/
Active
ESCC
Detail / Drawing
5 / -
Active
ADI
Detail / Drawing
A / -
Active
ESCC
Detail / Drawing
5 / -
Active