125 results found for MIL-STD-88

This test is conducted for the purpose of determining the ability of the microcircuit; to withstand the dynamic stress exerted by random vibration applied between...

This method specifies wafer fabrication control and wafer acceptance requirements for GaAs monolithic microcircuits for application in class level B or class level S...

Failure analysis is a post mortem examination of failed devices employing, as required, electrical measurements and many of the advanced analytical techniques of...

This method establishes the means for assuring circuit performance to the limits specified in the applicable acquisition document in regard to HIGH level output drive,...

This method establishes screening procedures for total lot screening of microelectronics to assist in achieving levels of quality and reliability commensurate with the...

This test procedure defines the detailed requirements for performing latchup testing of microcircuits to identify susceptibility to dose rate induced latchup.

The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package...

This method establishes a drive source to be used in measuring dynamic performance of digital microelectronic devices, such as TTL, DTL, RTL, ECL, and MOS.

This method establishes the load conditions to be used in measuring the static and dynamic performance of digital microelectronic devices such as TTL, DTL, RTL, ECL,...

The low dose rate work was performed at 0.10rad(Si)/s and the hig dose rate work was performed at 60rad(Si)/sper MIL-STD-883 Method 1019 as part of the Intersil wafer...