1989 results found for MIL-STD-883 methods
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
This method establishes qualification and quality conformance inspection procedures for microelectronics to assure that the device and lot quality conforms with the...
DLA
Method
17 /
Active
This method establishes the means of measuring the series impedance of the ground and power supply circuit pin configurations for packages used for complex, wide...
DLA
Method
2 /
Active
Failure analysis is a post mortem examination of failed devices employing, as required, electrical measurements and many of the advanced analytical techniques of...
DLA
Method
/
Active
This method establishes screening, qualification, and quality conformance requirements for the testing of complex monolithic microcircuits to assist in achieving the...
DLA
Method
4 /
Active
The purpose of this method is to detect unbonded and insufficiently bonded sites in TAB (Tape automated bonding) devices in the open package condition, through the...
DLA
Method
/
Active
Qualify TeamQuest Technology, Inc.as an additional site for Burn-in and Group C High Temp Operating Life Test (HTOL) processes for Military and Aerospace products...
Alert Documents
/ D
Active
This method establishes the means for measuring MOSFET threshold voltage. This method applies to both enhancement-mode and depletion-mode MOSFETs, and for both silicon...
DLA
Method
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Active
This test procedure defines the requirements for measuring the dose rate response and upset threshold of packaged devices containing analog functions when exposed to...
DLA
Method
3 /
Active
The purpose of this examination is to nondestructively detect defects within the sealed case, especially those resulting from the sealing process, and internal defects...
DLA
Method
11 /
Active
The purpose of this test is to verify that the amount of Lead (Pb) in Tin-Lead (Sn-Pb) alloys and electroplated finishes contain at least 3 weight percent (wt%) Lead...
DLA
Method
/
Active