327 results found for MIL-STD-883 method 2011
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
The purpose of this method is to reveal nonacceptable wire bonds while avoiding damage to acceptable wire bonds.
DLA
7 /
Active
The purpose of this test is to describe requirements for performance of destructive physical analysis (DPA) for the applicable device class, for sampling, preparation,...
DLA
1 /
Active
The purpose of this test is to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements of the...
DLA
10 /
Active
This method establishes qualification and quality conformance inspection procedures for microelectronics to assure that the device and lot quality...
DLA
17 /
Active
This method establishes screening, qualification, and quality conformance requirements for the testing of complex monolithic microcircuits to assist in...
DLA
4 /
Active
High dose rate testing to 300 krad(Si) . Low dose rate testing to 150 krad(Si) . The high dose rate irradiations were done at 65 rad(Si)/s and the low dose rate work...
TD
/ 0
Active
High dose rate testing to 300 krad(Si) . Low dose rate testing to 150 krad(Si) . The high dose rate irradiations were done at 65 rad(Si)/s and the low dose rate work...
TD
/ 0
Active
This section describes detailed requirements for a DPA of commonly used RF devices. These requirements supplement the general requirements in section 4.
DLA
/ C
Active
This section describes detailed requirements for a DPA of commonly used microcircuits. These requirements supplement the general requirements in section 4.
DLA
/ C
Active
MNFR
Detail / Drawing
A1 / -
Active