166 results found for MIL-STD-883, method 2021.

The purpose of this test is to assess the structural quality of deposited dielectric films (e.g., CVD, sputtered or electron beam evaporated glass or nitride, etc.)...

This method provides a means of judging the quality and acceptability of device interconnect metallization on non-planar oxide integrated circuit wafers...

This section describes detailed requirements for a DPA of commonly used microcircuits. These requirements supplement the general requirements in section 4.