119 results found for MIL-STD-750 method 2077

This test method provides a means of judging the quality and acceptability of metallization on semiconductor dice.

This test method describes procedures and evaluation guidelines for the destructive physical analysis (DPA) of wire bonded semiconductor devices.

This section describes detailed requirements for a DPA of commonly used transistors. These requirements supplement the general requirements in section 4

This section describes detailed requirements for a DPA of commonly used diodes. These requirements supplement the general requirements in section 4.