Servicio Familia
Cross Sectioning for Microprocessor
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Microprocessor
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
462 results found for Microprocessor/Processor/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Clock Frequency [Max]
Million Instruction per Second
Number of Bits
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQFP-68
10MHz
16-Bits
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CPGA-68
12,5MHz
16-Bits
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQFP-68 (Gull Wing)
25MHz
32-Bits
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-40
4-Bits
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQFP-132 (Gull Wing)
16,67MHz
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CPGA-145
883
Qualified
QPDSIS-38535
Surface Mount
CQFP-68
15MHz
16-Bits
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-44
8MHz
8-Bits
883
Qualified
QPDSIS-38535
Surface Mount
CQFP-68 (Gull Wing)