MIL-STD-750, Method 2037 Mechanical Test Methods for Semiconductor Devices Part 2: Bond strength (destructive bond pull test)
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The purpose of this test method is to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements of the applicable acquisition document.
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MIL-STD-750, Method 2037
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MIL-STD-750, Method 2037
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