MIL-STD-883, Method 2027 Mechanical Test Method Standard for Microcircuits: Substrate attach strength
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The purpose of this test is to determine the strength of the element attachment system when subjected to force in the Y1 axis. This method is applicable to semiconductor die attached to headers or substrates by means of organic materials. Uses include material evaluations and process control.
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MIL-STD-883, Method 2027
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