MIL-STD-883, Method 2036 Mechanical Test Method Standard for Microcircuits: Resistance to soldering heat
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This test method is performed to determine whether termination leads and other component parts can withstand the effects of the heat to which they will be subjected during the soldering process (solder iron, solder dip, solder wave, or solder reflow).
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MIL-STD-883, Method 2036
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