MIL-STD-750, Method 2100 Mechanical Test Methods for Semiconductor Devices Part 2: X–ray fluorescence (XRF) scan locations for discrete semiconductor Tin – Lead content analysis
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This test method establishes the XRF scan locations, guidance, and sampling plans for the semiconductor device package styles shown.
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04/03/2021 0:00:00
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MIL-STD-750, Method 2100
MIL-STD-750, Method 2100
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