MIL-STD-750, Method 2078 Mechanical Test Methods for Semiconductor Devices Part 2: Internal visual for wire bonded diodes_rectifiers
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The purpose of this test method is to verify the construction and workmanship of semiconductor devices utilizing junction passivated diode and rectifiers chips that use wire to chip technology.
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MIL-STD-750, Method 2078
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MIL-STD-750, Method 2078
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