MIL-STD-750, Method 2017 Mechanical Test Methods for Semiconductor Devices Part 2: Die attach integrity
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The purpose of this test method is to establish the integrity of the semiconductor die attachment to the package header or other substrate.
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04/03/2021 0:00:00
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MIL-STD-750, Method 2017
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MIL-STD-750, Method 2017
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