MIL-STD-750, Method 1055 Environmental Test Methods for Semiconductor Devices Part 1: Monitored mission temperature cycle
General data
This test method is to determine the ability of semiconductor devices to withstand the effect of thermal stress and rapid dimensional change on internal structural elements caused by the application of power in rapidly changing temperature environments as in mission profile system testing.
1 / A w/Change4
Active
15/04/2021 0:00:00
0 pages
Document history
Reference
Issue
Revision
MIL-STD-750, Method 1055
1
A w/Change3
MIL-STD-750, Method 1055
1
Document preview
Previous
{{docCtrl.currentPage}} of {{docCtrl.totalPages}} Pages
Next