XCN20006 Cross-Ship of Lead-Free Bump in Lead-Free Substrates for Virtex-4 FPGAs (FFGSFG Packages)
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The purpose of this notification is to announce Xilinx® will begin the transition to lead-free materials of the devices in the Virtex®-4 FPGAs. Defense-grade XQ and Automotive XA device-packages are not affected by this PCN.
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