Plating Thickness Testing Overview in Alter Technology Lab.
- Posted by Mari Carmen López
- On July 28, 2020
- 0
Plating Thickness Testing using Cross-sectioned pins are metallographic prepared in ALTER TECHNOLOGY Materials & Processes Laboratory.
Sample & Method
Metallographic analysis of pins allows us to check both the uniformity and thickness of plating and underplating coatings of pins. The major challenge of the sectioning process is to avoid smearing of the coatings. I order to obtain a high-quality surface the polishing parameters have to be adjusted depending on the coating material. Thickness measurements are collected using a metallographic microscope equipped with quantitative imaging software. Scanning Electron Microscopy is used to measure coating thickness down to microns.
Plating Thickness Testing Remark
This quantitative analysis allows us to evaluate if coatings applied to pins are within constructional requirements or standard specifications.
Contact us
Head Of Materials and Processes Laboratory
Mari Carmen has a degree in Degree in Chemistry and a PhD. in Materials Science.
She is responsible for the Materials & Process Laboratory of Alter Technology. Her work is focused on investigating the effects of the environment on electrical components, materials, and processes. As the head of the laboratory, she also manages the studies conducted to evaluate the quality of a bare or assembled printed circuit board in relation to ECSS standards or according to the customer’s specifications.
- Why Microsectioning sample preparation of PCB systems? - May 19, 2021
- Inspection of conformal coating on PCB using UV Light - August 4, 2020
- Plating Thickness Testing Overview in Alter Technology Lab. - July 28, 2020
0 comments on Plating Thickness Testing Overview in Alter Technology Lab.