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Thermo-Mechanical Analysis

  • Posted by Raquel Cano Cordero
  • On August 9, 2021
  • 0

Thermo-Mechanical Analysis Of Plastic Encapsulated Microelectronics (TMA)

The thermomechanical analysis (TMA) of plastic encapsulated microelectronic, and COTS parts is a fundamental technique to avoid (during the design and fabrication stage) and foresee anomalies related to the deformation of packages with temperature. Thus, this is a very effective tool to disclose and screen out possible reliability concerns related to the thermo-mechanical integrity and stability of the devices. This is because the TMA technique provides accurate information about the material’s coefficient of linear thermal expansion (CTE), shrinkage, softening, glass transition temperature (Tg), among others.

Besides, TMA instruments have a wide range of advanced options that can be used to determine viscoelastic properties such as the material’s stiffness (modulus), damping properties (tan delta), creep, and stress relaxation. The TMA is beneficial for measuring these material properties locally, especially in manufactured components or assemblies where the compatibility of materials is paramount.

Figure 1. Graph provided by the TMA 450 equipment showing CTE, Tg and Ts.

Figure 1. Graph provided by the TMA 450 equipment showing CTE, Tg, and Ts.

This test is highly relevant for New Space applications and is closely related (in fact, it is one of the main causes) to the appearance of the delaminations detected by SAM (Scanning Acoustic Microscopy) in plastic COTS, as the expansion and contraction of the component create great stress on its internal structure causing cracks or gaps. These failures can trigger other failure mechanisms (structural, electrical failure, etc.).

Figure 2. SAM images of a plastic package showing delaminations as a consequence of thermal stress.

Figure 2. SAM images of a plastic package showing delaminations as a consequence of thermal stress.

Our TMA 450 equipment capabilities include:

  • Non-contact, friction-free motor: Measures from soft compressive elastomers to stiff composite materials.
  • Wide-range, high-resolution measurement transducer up to 15nm.
  •  Different probes to enhance measurements: Expansion, Macro, Penetration.
  • Advanced testing modes: Modulated TMA, Dynamic TMA, Creep, and Stress Relaxation extend capabilities.
  • Great temperature control without liquid nitrogen from -70oC to 1000oC.

It meets industry standards.

  • ASTM E831. “Standard Test Method for Linear Thermal Expansion of Solid Materials by Thermomechanical Analysis
  • ASTM E1545. “Standard Test Method for the Glass Transition Temperature by Thermomechanical Analysis.”
  • ASTM D696. “Standard Test Method for Coefficient of Linear Thermal Expansion of Plastics Between −30°C and 30°C with a Vitreous Silica Dilatometer”.
  • ASTM D3386. “Standard Test Method for Coefficient of Linear Thermal Expansion of Electrical Insulating Materials.”
  • ISO 11359: Parts 1-3. “Plastics – Thermomechanical analysis (TMA)” – (Part 1. “General principles,” Part 2. “Determination of coefficient of linear thermal expansion and glass transition temperature,” Part 3. “Determination of penetration temperature.”).”

Thermo-Mechanical Analysis of Plastic

Co-autor: Francisco Javier Aparicio Rebollo

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Raquel Cano Cordero
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